UV Curing Solder Joint Protection Adhesive
3166 UV Curing Solder Joint Protection Adhesive is a thixotropic medium-high viscosity adhesive specially formulated for the protection of electronic solder joints and the reinforcement and strengthening of wires and cables. It features excellent surface drying and deep curing performance, good extrusion property, and broad adhesion to various plastics, metals and glass. After curing, it forms a hard amber transparent protective layer with outstanding moisture-proof and insulating performance, providing long-term reliable protection for solder joints and wire terminations.
Key Features
- Thixotropic medium-high viscosity of 6000±500 mPa.s for sag-resistant and precise dispensing
- Excellent surface drying and deep curing performance at 400 mJ/cm²
- Good extrusion property for smooth and efficient application
- Broad adhesion to various plastics, metals and glass
- High hardness of Shore D 78 and glass transition temperature of 72°C for durable protection
- High dielectric strength of 20 kV/mm for reliable insulation protection
Applications
- Protection and reinforcement of electronic solder joints
- Reinforcement and strain relief of wires and cables
- Strengthening of solder joints on PCB assemblies
- Bonding and protection of plastic, metal and glass components
- Moisture-proof and insulating protection of electronic assemblies
Technical Specifications
| Color |
Amber transparent |
| Viscosity (25°C) |
6000±500 mPa.s |
| Curing Condition |
400 mJ/cm² (UV) |
| Hardness |
Shore D 78 |
| Glass Transition Temperature (Tg) |
72°C |
| Dielectric Strength |
20 kV/mm |
| Shelf Life |
12 months (8-28°C) |
| Packaging |
250ml / 1kg |
FAQ
Q1: What is the 3166 adhesive mainly used for?
3166 is a UV curing adhesive used for the protection of electronic solder joints and the reinforcement and strain relief of wires and cables, providing moisture-proof, insulating and aging-resistant protection.
Q2: How fast does it cure?
3166 offers excellent surface drying and deep curing performance at 400 mJ/cm², ensuring reliable curing of both thin surface layers and thicker adhesive deposits.
Q3: Why is the thixotropic feature important?
The thixotropic medium-high viscosity keeps the adhesive in place after dispensing without sagging or flowing, while the good extrusion property ensures smooth and precise application.
Q4: What materials does it adhere to?
3166 provides broad adhesion to various plastics, metals and glass, which are commonly used in electronic assemblies and wire terminations.
Q5: What is the cured product like?
After curing, 3166 forms a hard amber transparent protective layer with Shore D 78 hardness, 72°C glass transition temperature and 20 kV/mm dielectric strength.
Q6: What are the storage conditions?
Store at 8-28°C in the original sealed container. Shelf life is 12 months. Available in 250ml and 1kg packaging.
Product Tags:
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3166 UV Curing Solder Joint Protection Adhesive Thixotropic Medium High Viscosity Surface Deep Cure Wire Reinforcement Images
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